Contact Us
Yield Ramp Service
Customized services for new process node development

Overview

As IC products are continuously driven by the demand for higher performance and lower manufacturing costs, new technologies, new material and improved processes are needed to further support the development and production of ICs. As a result, yield improvement becomes the key to successful process development and product introduction.
Semitronix complete solution based on electrical testing can greatly shorten the development cycle and improve the yield.
Through one-stop test chip design, electrical testing and analysis services, we help customers to successfully develop new processes/new product lines, and greatly shorten R&D cycle time, improving R&D quality and yield rate.

Services

Design program plan
Based on the process type, process nodes and the requirements of mass-produced products, the team proposes a preliminary design plan based on a library of test unit structures
Generate deliverable documents
Through the combination of the software tools (TCMagic, ATCompiler, etc.) and design methodologies, the chip layout and specific documentation that can be delivered to customers are generated
Transform standard test programs
After the tape-out is completed, the team converts the client's test specification document into a standard test program, which is combined with electrical test equipment to achieve wafer-level electrical testing
Generate submittable analysis reports
The DataExp data analysis platform enables effective in-depth analysis of the data from each production batch and generates submittable analysis reports.
Search for influencing factors
By combining with other customer data and product structure and function testing, we can open up the whole chain from manufacturing process sources, physical mechanisms, electrical characterization and other multiple links to find the factors influencing the yield rate.

Applications

In a new process development cooperation project with the customer, the team assessed the risk of the process, the advantages and disadvantages of different process options, and the degree of impact o...
Case 1: A new process development cooperation project

In a new process development cooperation project with the customer, the team assessed the risk of the process, the advantages and disadvantages of different process options, and the degree of impact of the above factors on the yield rate through a customized test chip; by assisting the customer for iterative experimental process after multiple batches of tape-out, the process achieved rapid maturity, within a few months, to achieve a breakthrough in the yield rate of the customer's SRAM (static memory).

Related Products: SmtCell / TCMagic / ATCompiler / Dense array   / DataExp

In a process service project, the team designed the dynamic parameters such as speed and power consumption at the test chip evaluation circuit level based on the customer's standard cell library, ...
Case 2: Process service project

In a process service project, the team designed the dynamic parameters such as speed and power consumption at the test chip evaluation circuit level based on the customer's standard cell library, isolated the causes limiting the product performance based on the test data, and found the sources of gaps in the device model based on the layout characteristics.

Related Products:ATCompiler  / DataExp

Baidu
sogou